[請益] 薄膜製程溫度與回火製程溫度硬度比較
我是做有關於兩種不同製程加熱方式的氮化鈦薄膜硬度測試
製程溫度為在濺鍍機內直接加熱
回火製程溫度是以常溫的薄膜進行熱回火加熱
同樣都是從100~300度
在硬度檢測時回火製程加熱100~300度的薄膜硬度居然會比常溫的還要低???
這是正常的嗎?
有大大可以給我幫我解答這個疑惑嗎?謝謝~
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