Re: [討論] 沒有準則的大學教職

看板AfterPhD (博士後)作者robertsss (GTO)時間15年前 (2009/04/12 18:06)推噓5(5推 0噓 16→)

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※ 引述《robertsss (GTO)》之銘言： : 看到下面老師的研究~~ : 大概都差不多 : 但有人在國立,有人在私立~~~這應徵真得很沒有準則 : 有人說!!!現在教職跟政治一樣~~很複雜 : 不是有實力的人可以出頭的!!! : 有些還要走後門@@@ : 有知情內幕的人~~請告知一下!!! : --------------------------------------------------------------------------- : 正修科大機械系 : http://me.csu.edu.tw/default.asp : http://me.csu.edu.tw/default.asp : 高應大機械系 : http://www.me.kuas.edu.tw/INDEX-ME.STAN.htm 正修科大機械系熊仁洲助理教授美國理海大學材料科學與工程博士分機:3931 二、　期刊、專書論文 1. J.C. Hsiung, R.A. Pearson and T.B. Lloyd, "A Surface Energy Approach for Analyzing Die Attach Adhesive Resin Bleed", J. Adhes. Sci. and Tech. 17 (2003) 1-13. 2. J.C. Hsiung and Y.T. Chou, "Fractal Characterization of Fracture Surface of a High-Strength Low-Alloy Steel", Journal of Materials Science 33 (1998) 2949-2953. 3. R.A. Pearson, T.B. Lloyd, H.R. Azimi, J.C. Hsiung, M.S. Early, and P.D. Brandenburger,"Adhesion Issues in Epoxy-Based Chip Attach Adhesives," IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A. Vol.20, No.1, March, (1997) 31-37. 4. 熊仁洲、劉復龍，超冷處理(Cryogenic Treatment)之簡介，金屬熱處理第35期81年12月，61-65頁。三、　會議、研討會論文 1. J.C. Hsiung and R.A. Pearson, "Processing Diagrams for Polymeric Die Attach Adhesives," in the Proceedings of 47th Electronic Components and Technology Conference (ECTC) to be held in San Jose, CA on May 18-21,1997. 2. R.A. Pearson, T.B. Lloyd, J.C. Hsiung, M.S. Early, and S. Phattanarudee, "Moisture Issues in Epoxy-Based Chip Attach Adhesives," in the Proceedings of the Sixth International Workshop on Moisture in Microelectronics, Gailhensburg, MD, October 15-17, 1996. 3. J.C. Hsiung and R.A. Pearson, "Bondability Diagrams for Die Attachment Processes," in the Proceedings of Semiconductor Research Corporation (SRC) TECHCON '96 Conference, Phoenix, AZ, September 12-14, 1996. 4. R.A. Pearson, T.B. Lloyd, H.R. Azimi, J.C. Hsiung, M.S. Early, and P.D. Brandenburger, "Adhesion Issues in Epoxy-Based Chip Attach Adhesives," in the Proceedings of the 2nd International Conference on Adhesives in Electronics '96, Stockholm, Sweden, June 3-5, (1996) 224-231. 5. R.A. Pearson, J.C. Hsiung, M.S. Early,and P.D. Brandenburger, "Fundamentals of Adhesion, Manufacturability, and Reliability of Epoxy-Based Chip Attach Adhesives," in the Symposium on "Application of Fracture Mechanics in the Electronic Packaging and Materials" at the ASME International Congress and Exposition, San Francisco, CA, November 12-17, 1995. 6. R.A. Pearson, J.C. Hsiung and P.D. Brandenburger, "Relationship Between Processing and Bond Performance in Epoxy Chip Attachment Adhesives," in the 1995 TMS Annual Meeting on February 12-16, 1995. 四、　發明、專利、證照、著作 1. 美國專利:PRACTICE CARTRIDGE (Patent No.: US 6,575,098 B2) 2. 中華民國專利:訓練用槍彈(發明第131110號) 3. 中華民國品質學會六標準差領導工程師(黑帶)證照 4. 中華民國品質學會六標準差領導工程師(綠帶)證照 5. 德國銲接協會鋁合金銲接證照 6. 中華民國財團法人中衛發展中心智慧財產權授權實務(訓練證明書) 7. 義守大學「行銷管理」班(結業證明書) 8. 聯勤技術訓練中心「勞工安全衛生管理員」訓練班(結業證明書) 9. 和春技術學院「積體電路實務培訓」班(結業證明書) 10. 國立雲林工業專科學校「非破壞檢測技術研習」班(結業證明書) 11. 中華民國非破壞檢測協會「超音波檢測」班(結業證明書) 五、　技術報告、其他 1. 中華民國品質學會高雄市分會品質研究小組副主任委員 2. 中華民國材料學會、中華民國熱處理學會及中國機械工程師學會會員 3. 獲國防部軍備局推薦參加行政院93年度表揚傑出科學與技術人才遴選(民國93年) 4. 獲頒中國機械工程師協會優秀機械工程師獎 (民國90年5月) 5. Awarded the 1997 Motorola -IEEE/CPMT Fellowship for Graduate Research on Electronic Packaging (May 1997). 6. Awarded the 1996 Hoechst Celanese Award, Lehigh University (November 1996). 黃秋虎助理教授美國壬色列理工學院機械工程博士分機:3313 二、　期刊、專書論文 1. “A Study for the Moisture Content of Graphite/Epoxy Composite with hygrothermal cycling”, Hung-Shyong Chen, Chyouhwu B. Huang, Hung Kwang Kung, Society of Manufacturing Society, Published: Feb 24, 2004, Product ID: TP04PUB47 三、　會議、研討會論文 1. “The Development of Calorimeter and Experimental Evaluation for Refrigerant Compressor of Automotive Air Conditioning System”, Jeng Nan Lee, Chyouhwu B. Huang, Kuen Jang Jang, Chu Wang Tsai, International Forum on Systems and Mechatronics 2006(IFSM 2006), Dec. 6-8, 2006, Tainan, Taiwan 2. “On the Study of Loop Profiles in Improving the Sweep Stiffness of Wire Bond”, H.K. Kung, C.H. Huang, A.I. Chanyshev, The 8th Electronics Packaging Technology Conference (EPTC 2006), Dec 6 - 8 2006, Singapore. 3. “Evaluation for the heat-sink performance of Mirco Porous Ceramics MPC”, Chyouhwu Huang, H. S. Chen, K.H. Kung 2006 Taiwan-Russia Research Cooperation Symposium, Nov. 7, 2006, Kaohsiung, Taiwan. 4. “Logistic Regression-based Machine Health Assessment Method on Application of Smart Machine Tool”, Linxia Liao, Chyouhwu Brian Huang, Jay Lee, International Manufacturing Leaders Forum 2006, Oct. 23-25, 2006, Taipei, Taiwan. 5. “Effect of bond spans and bond heights on the sweep stiffness of wire bond for semiconductor wirebonding technology”, Huang-Kuang Kung, Chyouhwu Huang and Hung-Shyong Chen, IMPAS-Taiwan 2006 International Technical Symposium, June 29-30, Taipei, Taiwan. 6. “The Bending and Twisting Moments Included Sweep Deflections for Semiconductor Package Applications”, H.-K. Kung, S.-M.Wu, J.-M. Jou, C.-H. Huang, The 29th National Conference on Theoretical and Applied Mechanics, Dec. 16-17, 2005, Hsinchu, Taiwan, R.O.C. 7. “Performance Evaluation of Multi-functional Silicon Cement (MSC)”, Hung-Shyong Chen, Chyouhwu B. Huang, Hung Kwang Kung, The Exposition of Joint Technological/Vocational Education and Industry Research Program. Nov. 18, 2003, Taipei, Taiwan 8. “A Comparison between the model analysis and experimental data for the moisture content of composite with hygrothermal cycling”, Hung-Shyong Chen, Hung Kwang Kung, Chyouhwu B. Huang, The 14th International Conference on Composite Materials (ICCM-14), July 14-18, 2003, Sandiego, CA. 9. 四、　發明、專利、證照、著作 1. Microsoft Certified System Engineer 2. Microsoft Certified Database Administrator 3. Microsoft Certified Professional 4. Certified Novel Administrator 五、　技術報告、其他 1. 黃秋虎、吳思明，“散熱技術應用於高容量輸出汽車用交流發電機的開發”，，正研產學字(94)第CS94ER01號，九十四年度教育部推動技專校院與產業園區產業合作計劃。進行中。 2. 黃秋虎、陳鴻雄， “孔洞化陶瓷MPC散熱性能評估”，千如電機工業股份有限公司，正修科技大學工程研究科技中心, 正研建教(93)第048號, 千如電機工業股份有限公司委託，93/09-94/03 3. 陳鴻雄、黃秋虎、龔皇光、吳思明， “多功能特殊矽水泥性能分析”,正修科技大學工程研究科技中心, ERTC-03-001, 鎮源貿易股份有限公司委託，92/6~92/9 4. H.S. Chen, C.B. Huang, H.K. Kuang, S.M. Wu, “Performance Evaluation of the Multi-functional Silicon Cement (MSC)”, technical report prepared for Kang’s Brother Co., Ltd. Under contract No. CSU-RD-2003-011, Sep. 2003. 高應大機械系蔡立仁職稱: 助理教授電話: ( 07 )-3814526 ext 5323 實驗室網頁：實驗力學與微元件製作實驗室學歷 ■美國凱斯西儲大學機械與航太工程學系博士期刊論文　 ■Tsai, L. and Prakash, V. (2005) Structure of weak shock waves in 2-D layered material systems, International journal of solids and structures, 47, 727-750. ■Yuan, F.; Tsai, L.; Prakash, V.; Rajendran, A.M. and Dandekar, D.P. (2007), Spall strength of glass fiber reinforced polymer composites, International Journal of Solids and Structures, 44, 7731-7747. ■Tsai, L.; Prakash, V.; Rajendran, A. M.; and Dandekar, D. P. (2007), Structure of shock waves in glass fiber reinforced polymer matrix composites, Applied Physics Letters, 6, 90. ■Yuan, F.; Tsai, L.; Prakash, V.; Dandekar, D.P. and Rajendran, A.M. (2008), Dynamic shear strength of S2 glass fiber reinforced polymer composites under shock compression, Journal of Applied Physics , 103, 103537. 　　研討會論文　　 ■Tsai, L. and Prakash, V. (2002). Structure of shock waves in layered hetrogeneous material systems. Modeling the performance of engineering structural materials III, Editors: T. S. Srivatsan, D. R. Lesuer, E. M. Taleef, TMS, OH, pp. 41-60. ■Tsai, L. and Prakash, V. (2003). Structure of shock waves in layered hetrogeneous material: Analytical results. Proceedings of the second international conference on structural stability and dynamics, Editors: C. M. Wang, G. R. Liu, K. K. Ang, Singapore, pp. 1034-1039. ■Tsai, L. and Prakash, V. (2003) Dispersion and Attenuation of stress waves in layered heterogeneous material systems. Proceedings of the 9th International Conference on Mechanical behavior of materials, Geneva, Switzerland. ■Tsai, L. and Prakash, V. (2005) Shock Response of S2 Glass Fiber Reinforced Composite. Feature presentation in Plasticity ’05, Kauai, Hawaii. ■Tsai, L. and Prakash, V. (2005) Shock Response of S2 Glass Fiber Reinforced Composite. Third International Conference on Structural Stability and Dynamics, Kissimmee, Florida, USA. ■Tsai, L. and Prakash, V. (2005) Dynamic Response and Spall Strength of S2 Glass Fiber Reinforced Polymer Composites. 2005 SEM Annual Conference, Portland, USA. ■Tsai, L.; Wang, D. J.; Perng, S. Y. and Fan, T. C. (2007), Multiple Quadrupole Magnetic Center Alignment on the Girder, 2007 Particle Accelerator Conference, Albuquerque, New Mexico, USA ■Tsai, L.; Chiang, C. C.; Yuo, F. A. and Lin, H. R. (2008), Dynamic Response of Low Friction, High Strength Hydrogels, 25th Annual Conference of Chinese Society of Mechanical Engineering, Changhua, Taiwan. 林昭文(Lin Jau-Wen ) 職稱: 助理教授電話: ( 07 )3814526 ext 5346 實驗室網頁：奈米創新技術研究室學歷 ■奧斯汀德州大學機械工程博士 ■俄亥俄州立大學工程力學碩士 ■國立交通大學土木工程學士經歷 ■國立高雄科學技術學院機械工程技術系助理教授 2000/2-迄今 ■研能科技股份有限公司產品開發處經理 1999/7-2000/1 ■大霸電子公司噴墨列印頭開發組組長 1995/5-1999/6 ■鴻海精密工業公司 BM/II 工程分析工程師 1992/10-1995/5 研究領域　 ■應用力學(有限元素分析) ■微系統設計及製程開發 ■微流體元件製作 ■非傳統式加工期刊論文　 ■經濟部工業局主導性新產開發計劃「壓電式噴墨列印頭」開發計劃合約, 合約編號:8601020807. ■1993, Photoelastic Uisualieaton of contact phenomena between real rtibology surfaces, with and without sliding, Wear, Vol.170, pp.267-279. 會議論文　 ■ Subsurface stress beneath a moving beat souree and inclined point foue, 26th Annual Technical meeting, Society of Engineering Science, 1989, September. 其他 ■壓電式噴墨列印頭 (經濟部) 計畫名稱經費期限補助單位擔任職務壓電式噴墨列印頭 1,000 85.1~86.12 經濟部　 -- ※ 發信站: 批踢踢實業坊(ptt.cc) ◆ From: 152.78.218.203

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