[情報] PhD openings Purdue ECE
代Po.
博後組的博後要前往Purdue Electrical and Computer Engineering department 擔任助
理教授。徵2-3位博士生。
Dr. Wu 是一個研究嚴謹且對學生很好的人，建議有興趣的人可以直接投遞履歷到Dr. Wu
的信箱。
資訊如下：
JOIN THE ADVANCED PACKAGING AND SEMICONDUCTOR LAB IN PURDUE ECE:
2-3 FULLY FUNDED PH.D. POSITIONS AVAILABLE
The Advanced Packaging and Semiconductor Lab, led by Dr. Can Wu in the Elmore
Family
School of Electrical and Computer Engineering at Purdue University, is looking
for 2-3
motivated Ph.D. students to join the group. We work at the intersection of sem
iconductor
devices, advanced packaging, and system integration to power next-generation
microelectronics. Ideal candidates will have a strong background in at least o
ne of the
following: micro/nanofabrication, semiconductor devices, and circuit design. W
e welcome students interested in one or more of the following topics: (1) glas
s interposer; (2) metal-oxide semiconductor; (3) network-on-package; (4) photo
nic interconnect; (5) power-
management circuits.
Dr. Can Wu is an incoming assistant professor in the Elmore Family School of
Electrical and Computer Engineering at Purdue University. He received his M.A.
and Ph.D.
degrees in Electrical and Computer Engineering from Princeton University in 20
17 and 2021,
respectively, and his B.S. degree from the Institute of Microelectronics at Ts
inghua University in 2013.
From 2021 to 2025, he was a postdoctoral scholar at Stanford University. His
research interests are emerging semiconductor and advanced packaging technolog
ies for
large-scale heterogeneous integration and systems. He has led more than 30 jou
rnal articles and conference proceedings, including Nature, Nature Electronics
, IEEE Journal of Solid-State Circuits, IEEE Transactions on Electron Devices,
and IEEE International Electron Device Meeting (IEDM). His work has been reco
gnized with the Best Student Poster Award at the 2015 Flex Conference, the Bes
t Student Paper Award at the 2019 Device Research Conference, and the Top-Rank
ed Student Paper at the 2023 IEDM. He is also the recipient of the Princeton U
niversity Gordon Wu Fellowship and the Purdue University Birck Scholar of Exce
llence.
If you are interested, please email Dr. Wu (canwu@purdue.edu) with your CV.
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