[新聞] iPhone 6 on 2014 Release Date to Show 已回收

看板Stock (股票)作者soniccsie (無言)時間12年前 (2013/09/28 20:54)推噓8(8推 0噓 11→)

留言19則, 12人參與討論串1/1

1.原文連結： http://au.ibtimes.com/articles/509408/20130927/iphone-6-release-date-liquidmetal-a8-chips.htm#.UkbP7iSwrIV 2.內容： Talks of the iPhone 6 as the most advanced iOS smartphone yet on its 2014 release date are gaining more steam as new patents for the cutting-edge mobile device frame and reports on ramped up production of A8 CPU emerged An Apple phablet wrapped in LiquidMetal, according to Patently Apple, is ever more approaching the sphere of reality as four new patents for the manufacturing technology have been unearthed by the Apple-focused tech site. The patents have been filed in Europe, said the same report, hinting of a new gadget casing system that allows Apple to forge its future iOS devices in irregular shapes, which gives credence to some iPhone 6 concepts depicting the handset with wrap-around display screen. Besides providing the technique for the tech giant to form its devices in numerous form factors, LiquidMetal also boosts durability, likely making for virtually indestructible iPhone housing. Note that the patent also applies to future iPad makes. The new patents, according to Patently Apple, point to the development of a 'fastener', which is "a hardware device that mechanically joins or affixes two or more objects together." Apple is focused on permanent fasteners, specifically those that include "airtight and watertight zippers that could be used sealing electronic devices, for example, the enclosure of a cell phone," said the report. The tech giant also termed the patent as Bulk Metallic Glass, which in mobile device manufacturing directly refers to the production of 'thin film of amorphous metals' by injection moulding. These can then "be deposited as protective coatings via a high velocity oxygen fuel technique," Apple stated on the patent. And it appears that the iPhone 6 killer features are not confined on the outside as fresh reports from Asia indicate that Apple is gearing to shift from A7 to A8 processing chips that use 20nm process nodes. DigiTimes from Taiwan has reported this week that "Taiwan Semiconductor Manufacturing Company (TSMC) has stepped up its purchases of manufacturing equipment for its 20nm process." By the first quarter of 2014, volume production of the chips will commence, setting up iOS devices lined up for that year to boast of the same chip architecture. Of course, the first to flash the new CPU is the rumoured iPhone 6 that according to analyst will debut by the first half of the same year. The same handset is the bearer of major iPhone upgrades, Apple watchers said, bannered by a larger screen that could breach the 5-inch mark, enhanced security features that the iPhone 5S has introduced via the fingerprint scanner Touch ID and wireless payment system using near-field communication of NFC. With technologies behind LiquidMetal and the A8 chip gaining more grounds, the notion that the iPhone 6 is the real deal is shaping up nicely for Apple fans. Yet they may have to wait for some more time for their hopes to translate into reality as the iPhone 6 release date countdown is not expected to begin ticking until March 2014, which is the earliest debut target for the device. 3.心得/評論(必需填寫)： A7才剛出現蜜月都還沒過 a8就開始在宣傳了... 台gg要準備暴衝了嗎? -- ※ 發信站: 批踢踢實業坊(ptt.cc) ◆ From: 61.223.60.162

推

ncku0610

09/28 21:26, , 1^F

09/28 21:26, 1^F

推

bearland

09/28 21:30, , 2^F

09/28 21:30, 2^F

推

PUTOUCHANG

09/28 21:33, , 3^F

09/28 21:33, 3^F