[新聞] 印度正押注180億美元來打造晶片強國
原文標題：
India is betting $18 billion to build a chip powerhouse. Here’s what it means
原文連結：https://tinyurl.com/2bj59v6s
發布時間：Mon, Sep 22 2025 6:58 PM EDT
記者署名：Priyanka Salve
原文內容：
India wants to become a global chip major, but the odds are steep: competition
is fierce, and India is a late entrant in the race to make the most advanced
chips.
印度希望成為全球晶片大國，但機率並不高：競爭激烈，而印度又是先進晶片競賽的遲來
者。
In 2022, when the U.S. restricted exports of its advanced AI chips to China to
curb Beijing’s access to cutting-edge technology, a global race for
semiconductor self-reliance began.
2022年，美國限制對中國出口先進AI晶片以遏制北京獲取尖端技術，全球半導體自給自足
的競賽由此展開。
For India, it offered an opportunity: the country wants to reduce dependence
on imports, secure chips for strategic sectors, and capture a bigger share of
the global electronics market shifting away from China.
對印度來說，這是個機會：該國希望減少對進口的依賴，確保戰略產業的晶片供應，並奪
取全球電子市場中正從中國轉移的一部分份額。
India is one of the world’s largest consumers of electronics, but it has no
local chip industry and plays a minimal role in the global supply chain. New
Delhi’s “Semiconductor Mission” aims to change that.
印度是全球最大的電子產品消費國之一，但本土沒有晶片產業，在全球供應鏈中幾乎無足
輕重。新德里的「半導體任務」旨在改變這一點。
The ambition is bold. It wants to create a full supply chain — from design to
fabrication, testing and packaging — on Indian soil.
這個野心很大：它希望在印度境內建立完整的供應鏈，從設計到製造、測試與封裝。
As of this month, the country has approved 10 semiconductor projects with
total investment of 1.6 trillion rupees ($18.2 billion). These include two
semiconductor fabrication plants, and multiple testing and packing factories.
截至本月，印度已批准10個半導體專案，總投資1.6兆盧比（約182億美元）。其中包括兩
座晶圓廠，以及多個測試與封裝工廠。
India also has a pool of engineering talent that is already employed by global
chip design companies.
印度還有一批工程人才，已經受聘於全球晶片設計公司。
Yet progress so far has been uneven, and neither the investments nor talent
pool is enough to make India’s chip ambitions a reality, say experts.
然而，專家表示，目前進展不均衡，無論投資還是人才庫，都不足以讓印度的晶片夢想成
真。
“India needs more than a few fabs or ATP facilities (i.e., more than a few “
shiny objects.”) It needs a dynamic and deep and long-term ecosystem,” said
Stephen Ezell, vice president for global innovation policy at the Information
Technology and Innovation Foundation, a science and technology policy think
tank.
「印度需要的不只是幾座晶圓廠或封測廠（即一些‘亮眼的項目’），而是一個有活力、
深度且長期的生態系統，」科技政策智庫 ITIF 全球創新政策副總裁 Stephen Ezell 說
。
Ezell says that leading semiconductor manufacturers consider “as many as 500
discrete factors” before they set up multi-billion-dollar fab investments.
These include talent, tax, trade, technology policies, labor rates and laws
and customs policies — all areas where India has work to do.
Ezell 表示，頂尖半導體製造商在決定數十億美元的晶圓廠投資前，會考慮「多達500項
因素」。這包括人才、稅制、貿易、科技政策、勞動力成本與法律，以及海關政策——而
這些領域印度仍有大量工作要做。
New Delhi’s policy push
新德里的政策推動
In May, the Indian government added a new element to its chip ambition: a
scheme to support electronic component manufacturing, addressing a critical
bottleneck.
5月，印度政府為晶片計畫增添新元素：一項支持電子零組件製造的計畫，以解決關鍵瓶
頸。
Until now, chipmakers had no local demand for their product as there are
hardly any electronic component manufacturing companies, such as phone camera
companies, in India.
直到現在，晶片製造商在印度沒有本地需求，因為該國幾乎沒有電子零組件製造公司，例
如手機鏡頭廠商。
But the new policy offers financial support to companies producing active and
passive electronic components, creating a potential domestic buyer-supplier
base that chip manufacturers can plug into.
但這項新政策為主動與被動電子零件公司提供資金支持，創造潛在的國內買賣關係網，讓
晶片製造商可以接軌。
In 2022, the country also pivoted from its strategy of providing superior
incentives to fabrication units making chips of 28nm or less. … New Delhi now
covers 50% of the project costs of all fabrication units, regardless of chip
size, and of chip testing and packing units.
2022年，印度也調整了政策，不再只針對28奈米以下的晶片製造廠提供優惠。如今，新德
里將承擔所有晶圓廠（無論晶片大小）及封測廠50%的專案成本。
Fab companies from Taiwan and the U.K., and semiconductor packaging companies
from the U.S. and South Korea have all shown interest in aiding India’s
semiconductor ambitions.
來自台灣與英國的晶圓廠商，以及美國與南韓的半導體封裝公司，都表示有興趣協助印度
的半導體計畫。
“The Indian government has doled out generous incentives to attract
semiconductor manufacturers to India,” said Ezell, but he stressed that “
those sorts of investments aren’t sustainable forever.”
「印度政府已祭出豐厚的補貼吸引半導體製造商來印度，」Ezell 說，但他強調「這類投
資不可能永續。」
The long road
漫長的道路
The biggest chip project in India currently is the 910-billion-rupee ($11
billion) semiconductor fabrication plant being built in Prime Minister
Narendra Modi’s home state of Gujarat by Tata Electronics, in partnership
with Taiwan’s Powerchip Semiconductor Manufacturing Corp.
目前印度最大的晶片專案，是由塔塔電子與台灣力晶合作，在總理莫迪的家鄉古吉拉特邦
建造的9100億盧比（110億美元）晶圓廠。
The unit will make chips for power management integrated circuits, display
drivers, microcontrollers and high-performance computing logic, Tata
Electronics said, which can be used in AI, automotive, computing and data
storage industries.
塔塔電子表示，該廠將生產電源管理IC、顯示驅動器、微控制器和高效能運算邏輯晶片，
可用於AI、汽車、運算與數據儲存等產業。
The U.K.’s Clas-SiC Wafer Fab has also tied up with India’s SiCSem to set up
the country’s first commercial compound fab in the eastern state of Odisha.
英國 Clas-SiC Wafer Fab 也與印度 SiCSem 合作，在東部奧里薩邦設立該國第一座商用
化合物半導體廠。
These compound semiconductors can be used in missiles, defence equipment,
electric vehicles, consumer appliances and solar power inverters, according to
a government press release.
根據政府新聞稿，這些化合物半導體可用於飛彈、國防裝備、電動車、消費電子與太陽能
逆變器。
“The coming 3-4 years is pivotal for advancing India’s semiconductor goals,
” said Sujay Shetty, managing director of semiconductor at PwC India.
「未來3至4年對推進印度的半導體目標至關重要，」PwC 印度半導體部門董事總經理
Sujay Shetty 說。
Opportunities beyond fab
超越晶圓廠的機會
Fabrication sites need to meet stringent requirements … with reliable road
connectivity — which can present ongoing logistical considerations for some
regions.
晶圓廠場址需要嚴格條件，例如避免洪水與震動，並具備可靠的道路連結——這對部分地
區是一大後勤挑戰。
India also needs specialty chemical suppliers that meet “ultra-high purity
standards essential for advanced semiconductor manufacturing,” Shetty added.
Shetty 補充，印度還需要能達到「超高純度標準」的特殊化學品供應商，這是先進半導
體製造不可或缺的。
Beyond chip fabrication plants, many medium-sized companies in India have
shown interest in setting up chip testing and packaging units … attracted by
its higher margins and lower capital intensity compared to fabs.
除了晶圓廠之外，許多印度中型企業也有意建立測試與封裝廠，因為相比晶圓廠，其利潤
較高、資本需求較低。
“Outsourced semiconductor assembly and testing (OSAT) represents a
significant opportunity for India, though clarifying market access and demand
channels will be important for sustained growth,” says Shetty.
「外包半導體組裝與測試（OSAT）對印度是一大機會，但必須明確市場進入與需求管道，
才能實現持續成長，」Shetty 說。
Success in this area will see India enter the global chip industry, but New
Delhi is still a long way from locally developing and manufacturing the
cutting-edge of chip technology: 2nm semiconductors.
若在這方面成功，印度將能進入全球晶片產業，但距離本地開發與製造最先進的2奈米晶
片，仍有很長一段路。
Last week, Indian minister Ashwini Vaishnaw … said the British company will
design the “most advanced chips used in AI servers, drones, mobile phone
chips of 2 nm” from the south Indian city.
上週，印度部長 Ashwini Vaishnaw 在班加羅爾為ARM新辦公室揭幕時表示，這家英國公
司將從南印度設計「用於AI伺服器、無人機與2奈米手機晶片的最先進晶片」。
But experts say the role of local talent is likely to be limited to non-core
design testing and validation, as the core intellectual property for chip
designs is often held in locations like the U.S. or Singapore.
但專家表示，本地人才的角色可能僅限於非核心的設計測試與驗證，因為晶片設計的核心
智慧財產權往往掌握在美國或新加坡等地。
“India has sufficient talent in design space … design has been there since
1990s,” said Jayanth BR, a recruiter … He said global companies usually
outsource “block-level” design validation work to India.
「印度在設計領域有人才，因為不同於近兩年才興起的製造與測試，設計自1990年代就存
在，」有15年以上半導體招聘經驗的 Jayanth BR 說。他表示，全球公司通常將「區塊層
級」的設計驗證工作外包給印度。
“India may consider updating its IP laws … Our competition is with countries
like the U.S., Europe, and Taiwan, which not only have strong IP laws, but
also a more established ecosystem for chip design.”
「印度可能需要更新其智慧財產權法律 … 我們的競爭對手是美國、歐洲與台灣，這些國
家不僅有強大的智慧財產權法律，還有更成熟的晶片設計生態，」孟買律所 JSA 的合夥
人 Sajai Singh 說。
心得/評論：
缺乏完整生態系統
半導體不是單一工廠，而是從設計、材料、設備、化學品到供應鏈的龐大網絡。
印度目前僅有零散項目，缺乏深度整合。
基礎建設不足
晶圓廠對水電、交通、防震要求極高，印度不符合條件，後勤難以長期維持。
人才結構不匹配
設計人才多，但製造與先進製程人才不足。
高階設計與核心IP仍掌握在美國/台灣/新加坡。
政策可持續性問題
政府提供的50%補貼極其昂貴，長期不可持續，
外企可能趁補助期間進駐，補助結束後撤離。
智慧財產權法律薄弱
核心IP容易流失，國際大廠不敢將關鍵技術放在印度。
國際競爭激烈
印度不僅落後台積電、三星、Intel數十年
，連中國都已有較完整的製造能力，印度更顯劣勢。
本地需求不足
印度雖是電子產品大國，但零組件多仰賴進口，
短期內難以形成支撐半導體大規模投產的本土市場。
--
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