[面試] 台積後段封裝
小弟剛剛收到台積電的面試通知
要面試的是後段封裝的製程整合工程師
由於實驗室同學幾乎都是去面試製程整合RD(20nm&10nm)
也不知道我為什麼會被挑到這個部門
對這個職稱的工作內容並不是很了解
所以想請教一下
有沒有面試相關訊息及工作內容或未來發展等
感謝~~
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