[新聞] SK海力士完成全球首款HBM4開發 準備量產
原文標題:
SK hynix completes development of world's 1st HBM4, readies mass production
原文連結:https://en.yna.co.kr/view/AEN20250912002300320
發布時間: 10:23 September 12, 2025
記者署名:Choi Kyong-ae
原文內容:
SEOUL, Sept. 12 (Yonhap) -- South Korean chipmaker SK hynix Inc. said Friday
it has completed development of HBM4, its next-generation high-bandwidth
memory (HBM) chip, and is ready for mass production of the chip for use in
ultra-high performance artificial intelligence (AI).
首爾,9 月 12 日(韓聯社)——南韓晶片製造商 SK 海力士週五表示,公司已完成其下
一代高頻寬記憶體(HBM)晶片 HBM4 的開發,並已準備好量產,用於超高性能的人工智
慧(AI)應用。
HBM is a core component for AI applications, with demand rising rapidly as the
memory chip significantly boosts data-processing speeds at data centers.
HBM 是人工智慧應用的核心組件之一,隨著該記憶體晶片能大幅提升資料中心的數據處理
速度,其需求正快速上升。
SK hynix said it is the first company in the industry to have finished
preparations for mass production of the next-generation HBM chip. HBM4 chips
will be produced at SK hynix's plant in Incheon, about 54 kilometers east of
Seoul.
SK 海力士表示,它是業界第一家完成下一代 HBM 晶片量產準備的公司。HBM4 晶片將在
該公司位於仁川(距首爾約 54 公里)的工廠生產。
The company said HBM4's power efficiency has improved by more than 40 percent
compared with its predecessor, the HBM3E, while AI service performance can be
enhanced by up to 69 percent.
公司表示,與前一代 HBM3E 相比,HBM4 的能效提升超過 40%,同時人工智慧服務的性能
可提升高達 69%。
With enhanced bandwidth and power efficiency, HBM4 is expected to meet growing
market needs by easing data bottlenecks and lowering data center energy costs
, SK hynix said in a press release.
SK 海力士在新聞稿中指出,憑藉提升的頻寬與能效,HBM4 預期能夠緩解數據瓶頸並降低
資料中心的能源成本,以滿足日益增長的市場需求。
"The completion of HBM4 development will be a new milestone for the industry,"
said Cho Joo-hwan, vice president in charge of HBM development at SK hynix.
「HBM4 的開發完成將成為業界的新里程碑,」SK 海力士 HBM 開發負責副總裁趙柱煥(
Cho Joo-hwan)表示。
The development of HBM4 represents a "symbolic turning point" that overcomes
the limits of AI infrastructure and addresses technological challenges in the
AI era, Kim Ju-seon, president and head of AI infrastructure at SK hynix, also
said.
SK 海力士總裁兼 AI 基礎設施負責人金周善(Kim Ju-seon)也表示,HBM4 的開發是一
個「象徵性的轉折點」,它突破了 AI 基礎設施的限制,並解決了 AI 時代的技術挑戰。
心得/評論:
HBM4 是 AI GPU 瓶頸的突破口,能顯著降低資料中心的能耗成本 →
提高雲服務業者(如 AWS、Azure、Google Cloud)採購 AI GPU 的意願。
對 NVIDIA、AMD 的 AI GPU 出貨 都是利好消息,
但最終效果會依供應鏈分配而偏向 NVIDIA。
對 美國 AI 生態 而言,這加深了對韓國記憶體產業的依賴,
可能引發美國政府對供應鏈安全的更多關注。
--
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